CSP into LED human vision is not one or two days, from Lumileds introduced to the now almost-chip companies have to participate, and even packaging companies are beginning to relate which, however CSP is applied in the lighting still very rare.
For CSP concept of hot, not only to reduce its costs in terms of cost, but from it into the LED industry on the “to be out of leather packaging business life” and fire. But if you want to compete with the current LED product front, I’m afraid not imagine so fast.
Advantages cost escalation CSP highlights
Full name CSP Chip Scale Package, also called chip level package. Conventional packaging which is defined as the volume of the same LED chip, or a volume of not more than 20% of the LED chip, and full-featured package member.
Which has been around for ages in the traditional semiconductor industry, according to the conventional semiconductor package development process point of view, it has undergone TO → DIP → LCC → QFP → BGA then CSP. This technique appears whose main purpose is to reduce package volume, improve the reliability of the wafer, the wafer to improve heat dissipation.
And since entering this year, LED industry gradually towards a mature, competitive advantages of conventional LED packaging products gradually rose to fight for money. According to TrendForce’s Green Energy Business Unit offers Show LEDinside, Q2 2835 mainland mainstream lighting market, declines of 10 to 17 percent, its main specifications 0.5W price decline is to reach 17%, visible LED has entered the large-scale price war era.
With the cost of large-scale era, whether it is large or listed companies focus on segments of the small and medium enterprises, there is a different competition. And in today’s lighting market, we compete to lower prices, each package promotional banner branded device constantly forced to quickly occupied the LED lighting market Heights. CSP can be described as homeopathy and health, to a large extent solve the customer requirements for the product cost.
Comparison of CSP can be applied directly in the customer’s PCB board ultimate goal of CSP is currently still in the initial stage of development. But once CSP achieve this ultimate goal, it will effectively shorten the heat source to heat the substrate to reduce the source of the thermal resistance path, whether it is from when the product price or stability, are better than the current LED.
From the industry point of view CSP mature period, because with no substrate, wire-free, small size and light density advantages, omitting some of the intermediate links, so that the costs have been dropped, to eliminate some of the uncertainty. In addition, since as existing traditional semiconductor technology has matured, when being re-used in the LED field, nature is able to shorten the maturity period of its technology.
From the technical point of view, because CSP is a very early use of the backlight and flash, its own technical problems do not exist, but because the mass production yield is not high, resulting in a high cost is the current problem. With the optimization and upgrading of process equipment, said CSP completely replace perhaps impossible, but definitely not the market just before those special areas of possession, future applications will be more extensive, especially in the lighting industry.
Restricting process maturity yield is the key
It is well known as a technical high content of CSP, how to cut, or select an entry point and catch up vital points. If too far ahead, one to the technical level of difficulty and the risk is too big, probably without success; followed by demand from the market point of view, is not enough to achieve market-oriented support force, resulting in a relatively small market, there are no technical or market caused blank period. Conversely, if too far behind, not only the gap between the level of the global LED industry is growing, resulting in wasteful of resources, also a departure from the mainstream market demand.
Here, we must mention or reference to the concept of ITRS (International Technology Roadmap for Semiconductors International Technology Roadmap for Semiconductors) technology node. This concept is defined as “to achieve significant progress in the process.”
The reason for the current CSP market applications in the lighting field little or not cost effective. And that reason is not dependent on high technology. CSP due to the small dimensions, the mechanical strength of the deficiencies, material sorting test process is difficult, SMT mount technology requires higher technical barriers, etc., resulting in finished product yield is not high. Thus, CSP package Free applications for lighting manufacturers belong to a new subject, there are still many issues to be resolved.
In this regard, LatticePower Hanmin Zhao also said that although the CSP technology reduce or even remove the stent, reduces packaging costs, but also have certain characteristics luminous appearance and better heat dissipation, etc., in the very attractive for many applications force, but subject to chip small, high precision placement equipment, unprotected stents, are more vulnerable than traditional SMD package and other limitations, making CSP in some areas will develop more quickly, while in other areas it would be more slow.
Having said that, but before the traditional dress contrast white LED development, CSP technology is mature period should be shorter than the original maturity period of LED being installed.
From the current point of view into the LED business, already mature LED products, technology has reached a pinnacle. Although CSP are still in the development stage, but the current LED LED when companies have not just touched, and now many of them not only have many years of industry experience, but also acquired a number of foreign companies with experience and get some related patents.
Thus, although the CSP is still not mature with the current price of LED products to fight, but the fight will not take much longer than the original LED maturity period.