IBM to build a successful four-qubit quantum computer is eligible for key breakthrough

IBM researchers have completed a four-qubit prototype circuit, to lay the foundation for the introduction of a real quantum computer. The circuit uses four ultra-low-temperature superconducting equipment to build. It is called quantum bits. It is also difficult to build a quantum chip technology bottleneck. Quantum processor chip became more and more important. Although today’s computer chips able to continue to pile up in the way of the pursuit of Moore’s Law transistors. However, the traditional means is becoming increasingly difficult to integrate more transistors. IBM Research Center director Supratik Guha said, “will certainly be the end of Moore’s Law in the next decade.”

Therefore, the computer industry will need to find a new way to grow, to provide chip performance, break through the bottleneck. IBM currently betting on a quantum computer, which may go beyond the traditional computer, to help develop a new generation of data analysis, machine learning, and encryption method of calculation. Last summer, IBM said, the next five years will invest $ 3 billion for the next generation of semiconductor research, including quantum computing.

Rely on quantum polymorphism, its speed is far better than the traditional computer. Because unlike semiconductor quantum only record 0 and 1, can represent multiple states simultaneously. If the semiconductor likened single instrument, like a symphony orchestra quantum computer, one operation can handle a variety of different conditions, so a 40-bit quantum computer, you can unlock the 1024 computer in a few decades to spend a short time problem. So quantum computer is like a heavyweight boxer, conventional computers as lightweights is not one level.

IBM researchers believe, can calculate hundreds of qubits computer may appear in 5-10 years. No one knows how long a quantum computer to replace traditional computer. Quantum computers can be used to crack the most powerful encryption method, or the search unimaginable amount of data.

Last month, Google also launched its own quantum circuits. Canadian company D-Wave announced that it has successfully developed a quantum computer. However, the quantum device really realize quantum computing has not yet been widely recognized by the academic community.


Toshiba to launch new products 13M pixel CMOS sensor, the volume is reduced by 24%

Toshiba is already in production 13 million pixel back-illuminated (BSI) CMOS image sensor “T4KB3”, and from April 24, 2015 start for smart phones and tablet PCs available.

Power consumption than existing products, new product “T4K82” (See related article) reduction of about 47%. According to reports, this is mainly due to power saving power supply circuit. Even at a rate of 30 frames / sec drive all 13 million pixels, power consumption is also less than 200mW.

New chip size compared with T4K82 also cut about 24%. Toshiba said, “to achieve the industry’s smallest die size.” The new product is equipped with a “bright mode”, can improve short exposure time, high-speed imaging quality. It can be equivalent to 120 frames / sec shooting high-quality full HD video.

New optical format 1 / 3.07 inches, a pixel pitch of 1.12μm. Reference Module size (length × width) aspect, autofocus is 8.5mm × 8.5mm, fixed focus type is 6.7mm × 6.7mm.

Foundry TSMC, Samsung has broken the dominance of the situation?

Analysts pointed out that the semiconductor market, Samsung (Samsung) has broken from the foundry market leader TSMC (TSMC) dominate – TSMC recently published in the first quarter of 2015, shortly after earnings, analysts predict that, with TSMC’s most profitable several process nodes, including major customers 28 nm to 16 nm, such as Qualcomm (Qualcomm), MediaTek (MediaTek), Apple (Apple), Nvidia and Marvell, turned to seek Samsung or other foundries as The second chip supply sources, TSMC fear of losing pricing power this year.

“Because of Samsung’s 14 nanometer yield has reached Qi Cheng, TSMC dominant situation in the foundry market has been broken;” Susquehanna International Group analyst Mehdi Hosseini said: “Samsung’s performance in the 14-nm node has been comparable to TSMC and can provide a lower per wafer average price. “In addition Hosseini pointed out that Samsung has made bargaining power with Qualcomm, MediaTek and Marvell other chip industry, as these chip industry is negotiating to enter the Samsung ready to launch in 2016 The new series of mobile phones; Samsung have more motivation to make use of its mobile phone chip design industry has won the case, as the chip foundry business exchange orders.

TSMC recently said it would speed up the 16-nm process mass production speed, while reducing the capacity of 20 nanometers; BNP Paribas (BNP Paribas) analyst Szeho Ng said TSMC’s 16 nanometer and 10 nanometer progress than expected increase, because anxious to consolidate their market leadership: “accelerated 10-nanometer manufacturing process development, after TSMC 16/14 nm node means losing dominance status, desperate to regain the lead; but we expect to go to 10 nanometers for the company to begin by the end of 2016 bring in revenue. ”

Ng further stated: “We recently accelerated from TSMC 16 nanometer FinFET process expanded to attract more orders Apple has made some clues A9 processor; however A9 can also use Samsung’s 14 nm FinFET process of production, if the process for the expansion of Samsung and Pricing more active, TSMC will be a risk. “In addition to Apple, TSMC customers another heavyweight Qualcomm Snapdragon 820 is also possible to switch to Samsung’s production;. Ng believes that because the TSMC foundry market dominance in precarious, The company may need to take price-cutting strategy.

Smartphone market growth slowed down, 28-nanometer process all competitors

The analysts also pointed out that, as the largest thrust TSMC business smartphone market growth has slowed down, it also brings worries for the company. “It is estimated 2015 global smartphone market volume growth rate of 13%, the figure was 23 percent in 2014;” The market research firm GFK report released in February, said: “2015 smart phone market growth slowing The main reason is the development of the market has reached saturation. ”

HSBC Bank (HSBC) analyst Stephen Pelayo said TSMC annual revenue from the previous seven customers in 2012-2014 between about 27 to 32 percent growth per year, TSMC’s total revenue contribution of approximately 38 to 44%; this During the segment TSMC just catch the smartphone boom, the market could reach an annual growth rate of 30 to 45 percent. TSMC before he listed seven clients including Qualcomm, Apple, Broadcom (Broadcom), MediaTek, Nvidia, Altera and Xilinx, but these customers the performance of this year’s revenue growth forecast only flat.

There are other worries that TSMC is now facing the threat of competitors have entered the market of 28-nanometer process technology node ── the past five years has not challenging. French BNP Paribas analyst Ng said: “This is the first time may have to stop TSMC’s 28-nanometer process extension, because of competition from other foundries increasingly intense, including UMC (UMC), Global Foundries, and Semiconductor Manufacturing International (SMIC) . “which UMC’s 28-nanometer manufacturing process yields continue to improve, but also to expand production capacity; this Bernstein senior analyst Mark Li said:” We expect TSMC will face the loss of market share and pressure on prices in the 28-nanometer process market. ”

TSMC outlook

TSMC has publicly expressed on many occasions, the company expects to acquire market share advantage in the next year to 16 nanometer and 14 nanometer node market; this may be expected from TSMC 16-nanometer chips FinFET process developed fan-out package (fan-out packaging) technology. According to Fubon Securities (Fubon Securities) analyst Carlos Peng said, including Apple, Qualcomm and MediaTek has dedicated team to support TSMC fan-out package technology launch.

“We expect these companies will continue to be published in the second half of 2016 using the fan-out package of the first products, locking high-end market, and to promote the growth of related supply chain;” Peng said: “The three companies will be TSMC fan-out style Major customers manufacturing process; we expect this integrated fan-out type (integrated fan-out, InFO) packaging technology will begin in the third quarter of 2016, in order to bring a sense of TSMC’s revenue and become the future of the new growth engine. “

Nichia developed to make LCD TV power semiconductor components 25%

LED giant Japanese company Nichia Chemical Industries developed a new semiconductor lasers can emit 1,000 times stronger than the original light with less power consumption, light and strong features. Some of which have been supplied to the motor manufacturer as the sample, for 2016 to achieve commercialization.

Emit light in the blue and green semiconductor lasers successfully developed three primary colors needed to get ready LCD TVs, according to Nichia and other reports, the power consumption is reduced by half when using this new semiconductor lasers LCD screen than with LED the amount. Due to the power consumption of LCD TVs accounted for half of the screen, so the future of TV is expected to more than 25% energy saving.

New research out of the blue and green semiconductor lasers, the use of the same GaN LED elements. Use 1.2 mm long, slender type element was, adding shade and cable to generate laser. Nichia through the transformation of a semiconductor device structure, success to emit light.

Previously, Mitsubishi Electric has successfully developed a semiconductor laser emits red light, a green and blue but has not been developed. Nichia the successful production of the two colors of semiconductor lasers, so they gathered the required three primary colors LCD screen. The future can be applied to large-screen, full-color projectors.

Sensors in the manufacture of electronic testing machine

Rally in electronic manufacturing and other machinery manufacturing, testing and sensor technology to achieve automatic control of the important part. Mechanical manufacturing test system, as an instrument positioning, its main feature is accurately detected and a transfer form information, and converts it into another mode of the information. Specifically, the sensor means that information of a measured object having determined feelings (or response) and the detection function, and make it according to certain rules to convert the output signal corresponding components or devices. If you do not test raw sensor for accurate and reliable information on the capture and conversion, all accurate test and control will not be achieved; even the most modern computer, there is no accurate information (or conversion of reliable data), undistorted input, it will not be able to fully play its due role.

Application in the manufacture of electronic testing machine, the main characteristics of high-quality sensors reflected as follows:
* Long life, high reliability, strong anti-jamming capability;
* Meet the accuracy and speed;
* Easy to use maintenance for machine operating environment;
* Low cost;
* Easy connection to a computer.

Cutting process and machine processes running sensor technology

The purpose of the cutting process is to optimize the sensing of the cutting process productivity, manufacturing cost, or (metal) material removal rate. Sensing the cutting process goals of cutting force and changes in the cutting process, the cutting process tremble, the tool and the workpiece and the cutting chips contact state and cutting process identification, etc., but the most important parameters are cutting force sensing, cutting process vibration, acoustic emission cutting process, the cutting process of the motor power and so on.

For operation of the machine is concerned, the main goal of sensing a drive system, bearings and slewing system, temperature monitoring and control and safety, with its sensing parameters machine downtime, the surface roughness of the workpiece and precision, power, machine status and the coolant flow.

Things to grasp market opportunities not just look at the surface

Market research firm IDC’s latest report predicts that the Asia-Pacific region of Things (IoT) industry will continue strong growth in 2020, networked devices in the region will increase from the current 31 million units to 86 million units; the same period in the forecast the whole Asia-Pacific region (excluding Japan) Things to US $ 250 billion market size will increase to 5,830 billion US dollars.

“Things in the past few years, the industry has been maturing in the Asia-Pacific market, there are many large government-related plans, especially in China, driving the demand for related solutions;” IDC Asia Pacific operations and networking market research director of Reed Anderson said: “Let each increased demand leading ICT suppliers, and companies are more focused on creating new things, and actively want this growing field of application for a place.”

Anderson also pointed out that although certain readers, high-level regional networking market forecast data is useful, but these data for the specific needs of these failed to bring the regional market value: “For example, the business and marketing staff will need to be consistent with industry vertical market forecast of things, they can set goals and efficient market access when away; and product managers will need to use context (such as digital signatures) to predict things related They can understand the cross-industry solutions for the different target markets. ”

Things IDC’s market forecast report, China is not only in the Asia-Pacific region continues to lead the market demand, in 2020 the contribution of the Asia-Pacific region as a whole of things the market will reach 59 percent, is among the best in the global market, it is estimated that in 2020, each kinds of networking devices have one every five units in China. But China’s IOT market size compared with the mature market still has some gaps. Anderson said: “Although the Chinese market opportunities with the amount of things look, let South Korea, India, Indonesia and Australia and other markets dwarfs, is not the most mature.”

Anderson explained that the total population of IDC is the number of countries and compare the total number of networked devices to determine the maturity of a market; in this calculation method, the Asia-Pacific region’s most mature market, the top three things are South Korea, Australia and New Zealand, and China maturity in 13 countries in the Asia Pacific region ranked sixth.

In a variety of industrial applications of networking technology, the government accounted for the largest non-accidental cases, as countries either central or local governments are actively using networking solutions to create new sources of revenue, reduce costs and enhance the public services to be used as part of the “wisdom of government” plan; the other popular industrial networking applications do not also include utilities, manufacturing, healthcare and retail industries.

“For the attention of Things makers, industry must understand what is driving the market demand, and the regional market will be different;” Anderson said: “In Singapore, for example, the highest demand for physical interconnection telecommunications industry, consumption and traffic, but a few industries and the Asia Pacific region have not ranked in the top five popular networking applications industry. “He suggested that the things the industry must understand these detailed market information, in order to successfully grasp opportunities.

GPU performance upgrade mobile market, the competition and the Battle

SoC era, mobile phones, tablet PCs, wearable and other mobile devices not only to fight the CPU core processor, assume performance, differentiated task of GPU also of concern. DIGITIMES Research for analysis for the global mobile processor GPU manufacturers and shipping development trends, 2015 ARM Mali architecture products in low-cost strategy to play in the mainland market, not only to maintain the status of the world’s largest supplier and market share will jump to 40 percent or more. The second original maker Imagination eroded by ARM market, coupled with the city in 2014 accounted for Qualcomm gap is quite small, estimated in 2015 will be relegated to the third-largest.

Recalling the 2014 GPU market performance, DIGITIMES Research data show, Imagination and Qualcomm has become the largest mobile platform shipments graphics architecture, Imagination in 2014, although barely hold second place, but in 2015 the high-pass and Imagination market rankings probably will reversed.

From the observation of various graphics architecture, ARM and Qualcomm because of the limited improvement in terms of micro-architecture, started to enter the practice of stacking a large number of computing units, and by the improved technology to suppress the power upgrade, NVIDIA and Imagination improved microarchitecture there are more obvious results.

The new study was important progress in the two-dimensional semiconductor LED lights cost or drop

The market can buy LED lights, although power consumption is only 6% of incandescent lamps, life of up to 50,000 hours, but tens of times the price, the LED light can not easily walk into ordinary people’s homes. Recently, this reporter learned from Nanjing University, the school has made a new type of two-dimensional semiconductor research on important progress, is expected to create a new material, which greatly reduces the cost of production LED lights, the research published online in chemistry and materials science and other top journals “Germany Applied Chemistry “, and by Nature, NanoWerk, new materials and other academic online media coverage of the highlights.

It is understood that the high brightness LED lights, low power consumption, no radiation, non-toxic ingredients, but also in areas not covered by the grid, relying on solar energy can be used. Tension in the earth’s resources, serious environmental pollution today, for all of humanity has very important significance. 2014 Nobel Prize in Physics was awarded to the blue light-emitting diode (LED) inventor of the blue LED R & D biggest difficulty has been overcome.

Institute of Nano-optical materials have Hyperion school director, said, LED basic structure is an electroluminescent semiconductor material chip, the main material used in the production is made of gallium nitride. This is necessary to prepare high-temperature vacuum semiconductor material, expensive, is an important reason for the high price of LED lights, can not be promoted.

In recent years, drawing widespread graphene and other new materials exhibit excellent performance, very suitable, including LED, including information on energy used to manufacture the device. However, these new materials have fatal flaws – metallic or semi-metallic properties, and used in the production of semiconductor material must have properties, how to change the properties of these materials has become difficult to overcome the bottlenecks in the academic material.

Hyperion has said the new material designed for single school arsenic and antimony-ene-ene, only one atom thick, with semiconductor properties. This ultra-thin material stability, superior performance, broad application prospects. Huanan Institute of Materials Chung Yan teacher said, “The new material once used for applications, these devices not only wearable performance leaps and bounds, and will be more slim, the price will be more close to the people.”

Image Sensor: CCD towards the end, CMOS longevity?

Analyst with market research firm Yole Developpement’s Pierre Cambou new comments in an article pointed out, a charge-coupled components (charge-coupled device, CCD) image sensor has to end.

Contributed to the review because the market leader Sony customer rumors that the company will exit the CCD image sensor and camera manufacturing business ── expected Sony will begin in March 2017, stopped stronghold Kagoshima (Kagoshima Technology Centre) 8 inch CCD sensor wafer production line in 2020 is completely out of the technology.

Cambou said: “The timetable has not been determined, because discussions are still in progress; but one thing is for sure ── This is the starting point for Sony CCD sensor towards the end of the business.”

According Cambou saying, CCD image sensor still provides the best performance in certain applications, and can not be replaced by CMOS image sensors, but rely on Sony CCD image sensor production customers may have to find another supplier, such as Teledyne Dalsa, On Semiconductor , e2v, Fairchild Semiconductor, or switch to CMOS image sensors.

“For industry experts, it looked technology transfer brings creative destruction is always sad;” Cambou said: “But I think this will update the driving force of a major shift in the industry so that we are ready to move towards the new. The technology cycle, I believe we will not be disappointed; Although CCD image sensor is dead, CMOS image sensor longevity in “!

World’s largest OLED module measures 320 x 320 mm

LG Chem is currently the largest OLED module comes with a luminous flux of 1000 lumens and a color temperature of 3000 Kelvin. The highlight: The substrate is applied on flexible plastic.

Flexible OLED Lamp: The 3-D flexible OLED module called P6BA30C of LG Chem measures 211 mm x 50 mm. Since the OLED layers are applied on a plastic substrate, it is flexible and twistable. With a color temperature of 3000 K is suitable OLEDs for use as a design-related bulbs.

Another OLED module of LG Chem is the world’s largest N6SD30C. It measures 320 mm x 320 mm. It achieved with a current of 2 A a luminous flux of 1000 lm. This module is available with a color temperature of 3000K. Thanks to the CCL encapsulation the OLED module comes to a thickness of 0.88 mm. These modules can be implemented extremely intricate designs. For both OLED modules Neumüller includes reference amounts of in stock.